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The global market for Photonic Integrated Circuit (PIC) is projected to reach US$3.1 billion by 2025

ReportLinker
·26 min de lecture

driven by the growing interest in the ability to exploit the properties of light to transmit information at speeds millions of times faster than either copper or laser, especially against the backdrop of the insatiable need for bandwidth and communication speeds.

New York, Nov. 03, 2020 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Global Photonic Integrated Circuit (PIC) Industry" - https://www.reportlinker.com/p03646045/?utm_source=GNW
The growing opportunity in optical communications therefore bodes well for the growth of PICs. Optical communication, also known as optical telecommunication, is growing in popularity driven by factors such as demand for faster internet broadband speeds, ubiquity of data communications networks, and growing use of bandwidth intensive applications such as provision of high speed internet (HSI) and triple play bundled services that includes voice, data, and video streaming. Investments in optical network infrastructures are therefore witnessing robust gains. In addition to telecommunication service providers and MNOs, even companies are rapidly shifting to fibre-optic enabled enterprise networks to handle ever-increasing big data loads and leverage benefits of technologies like IoT, cloud and artificial intelligence. While migration from copper wires to optical fibre access networks begins to mature, there is currently a strong undercurrent of change in the optical networking industry. The industry is witnessing a shift from Passive Optical Networks (PON) technology to Active Optical Network (AON). PON technology utilizes optical splitters to separate light signals of different wavelengths as they are transmitted through the network. AON, on the other hand, utilizes electrical switching equipment like routers, switch aggregator, amplifiers and repeaters, for signal distribution, management and delivery.

Increased deployment of agile optical networks (AON) by network service providers is expected to open up new opportunities for the use of PICs in enabling dynamic scaling of network infrastructures in response to fluctuating data traffic. Few of the factors that will help widen the application and adoption of PICs include breakthroughs in the development of application specific photonic integrated circuits (ASPICs) for new generation optoelectronic devices; innovations in fabrication technologies of ASPICs; surging investments in advanced telecom infrastructure; progressive improvements in photonic integration with conventional technology processes; emphasis on optical signal processing in fiber optic networks; high tide in Wi-Fi equipment installations; and emerging era of quantum computing, among others.

Integration of silicon photonics devices with traditional electronics will unleash new opportunities in on-chip and on-board communication; chip-to-chip interconnections; optical sensing and biophotonics. As we inch closer to exascale computing, optical interconnections will offer an alternative to the otherwise dense network of copper interconnections that will be needed. Photonic Integrated Circuit (PIC) integrates multiple photonic functions and hence is more suitable for exascale processing. While electronic integrated circuits are dense, they can never match the speed offered by PICs. PICs have higher bandwidth; higher levels of immunity to electromagnetic interference; and are compatible with current CMOS fabrication technologies. A PIC comprises of optical devices such as modulators, optical amplifiers, lasers and multiplexers. Asia-Pacific including China is a major market led by developing telecom and electronics industries and rapid shift of the global semiconductor manufacturing base to Southeast Asian countries.


Read the full report: https://www.reportlinker.com/p03646045/?utm_source=GNW

I. INTRODUCTION, METHODOLOGY & REPORT SCOPE

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW
An Introduction to Photonic Integrated Circuit (PIC)
Materials Used in Making PIC
Integration Models for PIC
Applications
Photonic Integrated Circuit (PIC): Current Market Scenario and
Outlook
Indium Phosphide: Largest & Fastest Growing Material Type
Silicon Substrates Remain in Contention
Hybrid Integration: The Widely Used PIC Fabrication Method
Monolithic Integration Emerges as Fastest Growing Fabrication
Approach
COMPETITIVE LANDSCAPE
Photonic Integrated Circuit (PIC): Fragmented Marketplace
Photonic Integrated Circuit (PIC) Competitor Market Share
Scenario Worldwide (in %): 2020
Recent Market Activity
Impact of Covid-19 and a Looming Global Recession

2. FOCUS ON SELECT PLAYERS

3. MARKET TRENDS & DRIVERS
Optical Communications: Largest Application Market for PIC
Key Trends Influencing the Uptake of PICs in Optical
Communication Space
Soaring Deployments of 100G & Ultra-100G OTNs
Growing Uptake of FTTx Networks
Growing Bandwidth Needs Bring Fiber Optic Networks to the Fore,
Steering PIC Demand
Global IP Traffic Volume in Exabytes for the Years 2019 and 2022
Global IP Traffic Scenario (2019): Percentage Breakdown of Data
Usage by Consumer Segment
A Note on Factors Influencing IP Traffic Growth & Bandwidth Needs
Sharp Increase in Number of Internet Subscribers
Breakdown of Number of Internet Users Worldwide, by Region
(in Millions): H1 2019
High Penetration of IP-enabled Devices
Smartphone Adoption Worldwide by Region (in %): 2018 & 2025
Number of Smartphone Users Worldwide (in Billion): 2016-2022
Global Wireless Communication Market (2018 & 2020): Percentage
Breakdown of Traffic Volume by Mobile Device Type
Faster Broadband Speeds
Proliferation of Bandwidth-Intensive Applications
Breakdown of Global IP Traffic by Application Type (in %): 2019 &
2022
Infrastructure Verticals Where Telecom Investments Continue to
Remain High
Long-Haul Networks
Metropolitan Area Networks (MANs)
Access Networks
Optical Signal Processing Emerges as Fastest Growing
Application Segment
Biophotonics: A Niche Market Segment for PIC
Global Biophotonics Market (2019): Percentage Breakdown of
Revenues by Geographic Region
Expanding Application Base for Biophotonics Generates Parallel
Opportunities for PIC
Increased Focus on Optical In-Vitro Diagnostics Augurs Well
Northbound Trajectory in Fiber Optic Sensors Vertical Gives
Impetus to Market Expansion
Global Fiber Optic Sensors Market (2019 & 2024): Breakdown of
Sales in US$ Million by Geographic Region
Expanding Role of DCI in Data Centers Creates Potential Market
Opportunities
Major Data Center Trends Influencing DCI Implementations
Rapid Growth in Data Center Traffic
Data Center New Floor Space Capacity Additions (in ?000 Sq. ft.)
Worldwide for the Years 2013, 2015, 2017, and 2019
Sharp Expansion in Cloud Data Center
Global Data Center Traffic Scenario (2018, 2020 & 2022):
Percentage Breakdown of Data Center Traffic by Equipment Type
Global Cloud Data Center Market (2018 & 2022): Percentage
Breakdown of Data Center Traffic by Cloud Type
Transition towards Data Center Consolidation
Growing Role of Virtualization
High Tide in Wi-Fi Equipment Installations Bodes Well
Smart Cities Concept to Underpin Sales Growth in the Coming Years
World Smart City Investments (in US$ Billion) for the Years
2018 through 2025
Breakdown of World Smart City Investments (in %) by Country/
Region for the Year 2019
Smart Homes to Drive Demand for PICs
Global Smart Homes Market (In US$ Billion) for the Years 2019,
2021, 2023 & 2025
Upcoming Quantum Computing Model to Infuse New Growth
Opportunities
Economic Unviability of Electronic IC in OEO Conversion Puts
Focus on Photonic IC
Photonic IC vs. Electronic IC: A Brief Comparative Analysis
Reduced Number of Optical Packages & Decreased Need for Fiber
Coupling Enhance the Image of PIC
Technology Innovations: Key to High Growth and Consistent Demand
Next Generation Silicon Photonics & Polymer Based Photonic ICs
Enhance Speed, Bandwidth and Scalability
Collaborative Initiatives Foster Development of Innovative
Products

4. GLOBAL MARKET PERSPECTIVE
Table 1: World Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Geographic Region - USA, Canada,
Japan, China, Europe, Asia-Pacific, Latin America, Middle East
and Africa Markets - Independent Analysis of Annual Sales in
US$ Million for Years 2020 through 2027

Table 2: World 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Geographic Region - Percentage Breakdown of
Value Sales for USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets for
Years 2020 & 2027

Table 3: World Current & Future Analysis for Hybrid Integration
by Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2020 through 2027

Table 4: World 7-Year Perspective for Hybrid Integration by
Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2020 & 2027

Table 5: World Current & Future Analysis for Monolithic
Integration by Geographic Region - USA, Canada, Japan, China,
Europe, Asia-Pacific, Latin America, Middle East and Africa
Markets - Independent Analysis of Annual Sales in US$ Million
for Years 2020 through 2027

Table 6: World 7-Year Perspective for Monolithic Integration by
Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2020 & 2027

Table 7: World Current & Future Analysis for Module Integration
by Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2020 through 2027

Table 8: World 7-Year Perspective for Module Integration by
Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2020 & 2027

Table 9: World Current & Future Analysis for Indium Phosphide
(InP) by Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2020 through 2027

Table 10: World 7-Year Perspective for Indium Phosphide (InP)
by Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2020 & 2027

Table 11: World Current & Future Analysis for
Silicon-on-Insulator (SOI) by Geographic Region - USA, Canada,
Japan, China, Europe, Asia-Pacific, Latin America, Middle East
and Africa Markets - Independent Analysis of Annual Sales in
US$ Million for Years 2020 through 2027

Table 12: World 7-Year Perspective for Silicon-on-Insulator
(SOI) by Geographic Region - Percentage Breakdown of Value
Sales for USA, Canada, Japan, China, Europe, Asia-Pacific,
Latin America, Middle East and Africa for Years 2020 & 2027

Table 13: World Current & Future Analysis for Gallium Arsenide
(GaAs) by Geographic Region - USA, Canada, Japan, China,
Europe, Asia-Pacific, Latin America, Middle East and Africa
Markets - Independent Analysis of Annual Sales in US$ Million
for Years 2020 through 2027

Table 14: World 7-Year Perspective for Gallium Arsenide (GaAs)
by Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2020 & 2027

Table 15: World Current & Future Analysis for Silicon (Si) by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2020 through 2027

Table 16: World 7-Year Perspective for Silicon (Si) by
Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2020 & 2027

Table 17: World Current & Future Analysis for Other Raw
Materials by Geographic Region - USA, Canada, Japan, China,
Europe, Asia-Pacific, Latin America, Middle East and Africa
Markets - Independent Analysis of Annual Sales in US$ Million
for Years 2020 through 2027

Table 18: World 7-Year Perspective for Other Raw Materials by
Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2020 & 2027

Table 19: World Current & Future Analysis for Optical
Communications by Geographic Region - USA, Canada, Japan,
China, Europe, Asia-Pacific, Latin America, Middle East and
Africa Markets - Independent Analysis of Annual Sales in US$
Million for Years 2020 through 2027

Table 20: World 7-Year Perspective for Optical Communications
by Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2020 & 2027

Table 21: World Current & Future Analysis for Optical Signal
Processing by Geographic Region - USA, Canada, Japan, China,
Europe, Asia-Pacific, Latin America, Middle East and Africa
Markets - Independent Analysis of Annual Sales in US$ Million
for Years 2020 through 2027

Table 22: World 7-Year Perspective for Optical Signal
Processing by Geographic Region - Percentage Breakdown of Value
Sales for USA, Canada, Japan, China, Europe, Asia-Pacific,
Latin America, Middle East and Africa for Years 2020 & 2027

Table 23: World Current & Future Analysis for Other
Applications by Geographic Region - USA, Canada, Japan, China,
Europe, Asia-Pacific, Latin America, Middle East and Africa
Markets - Independent Analysis of Annual Sales in US$ Million
for Years 2020 through 2027

Table 24: World 7-Year Perspective for Other Applications by
Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2020 & 2027

III. MARKET ANALYSIS

GEOGRAPHIC MARKET ANALYSIS

UNITED STATES
The United States: Largest Market for PIC Solutions
Telecom Industry?s Focus on High-Speed Fiber Networks Builds
Momentum
Fiber Optic Deployments Register Steady Growth
Fiber Optics Industry Benefits from Telecom Regulatory Act, 1996
Percentage (%) of Population Covered by Fiber Networks in
Select States
Novel Use Case of Biophotonics in Medical Devices Augurs Well
Mainstream Image of Fiber Optic Sensors to Underpin Market
Expansion
Market Analytics
Table 25: USA Current & Future Analysis for Photonic Integrated
Circuit (PIC) by Technique - Hybrid Integration, Monolithic
Integration and Module Integration - Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027

Table 26: USA 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique - Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027

Table 27: USA Current & Future Analysis for Photonic Integrated
Circuit (PIC) by Raw Material - Indium Phosphide (InP),
Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon
(Si) and Other Raw Materials - Independent Analysis of Annual
Sales in US$ Million for the Years 2020 through 2027

Table 28: USA 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material - Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027

Table 29: USA Current & Future Analysis for Photonic Integrated
Circuit (PIC) by Application - Optical Communications, Optical
Signal Processing and Other Applications - Independent Analysis
of Annual Sales in US$ Million for the Years 2020 through 2027

Table 30: USA 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application - Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027

CANADA
Uptrend in the Telecom Sector Encourages PIC Market
Growing Use of Fiber Optic Sensors Revs Up PIC Demand
Market Analytics
Table 31: Canada Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique - Hybrid Integration,
Monolithic Integration and Module Integration - Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027

Table 32: Canada 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique - Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027

Table 33: Canada Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material - Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials - Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027

Table 34: Canada 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material - Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027

Table 35: Canada Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application - Optical
Communications, Optical Signal Processing and Other
Applications - Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027

Table 36: Canada 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application - Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027

JAPAN
Being a Major Fiber Optics Consumer, Japan Continues to Extend
Opportunities
Market Analytics
Table 37: Japan Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique - Hybrid Integration,
Monolithic Integration and Module Integration - Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027

Table 38: Japan 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique - Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027

Table 39: Japan Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material - Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials - Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027

Table 40: Japan 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material - Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027

Table 41: Japan Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application - Optical
Communications, Optical Signal Processing and Other
Applications - Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027

Table 42: Japan 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application - Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027

CHINA
China Emerges as the Fastest Growing Regional Market
Uptrend in Fiber Optic Deployments Enthuses PIC Market in China
Increased Adoption of Fiber Optic Sensors Infuses Market Momentum
Sensors Manufacturing Scenario in China
Market Analytics
Table 43: China Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique - Hybrid Integration,
Monolithic Integration and Module Integration - Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027

Table 44: China 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique - Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027

Table 45: China Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material - Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials - Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027

Table 46: China 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material - Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027

Table 47: China Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application - Optical
Communications, Optical Signal Processing and Other
Applications - Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027

Table 48: China 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application - Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027

EUROPE
Stable Expansion in Fiber Optic Networks Bodes Well for PIC
Market in Europe
Healthy Home Entertainment Sector Spurs Demand for Fiber Optic
Networks
Household Penetration of FTTH & FTTB (in %) in Select European
Countries: 2019
Market Analytics
Table 49: Europe Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Geographic Region - France,
Germany, Italy, UK, Spain, Russia and Rest of Europe Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2020 through 2027

Table 50: Europe 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Geographic Region - Percentage Breakdown of
Value Sales for France, Germany, Italy, UK, Spain, Russia and
Rest of Europe Markets for Years 2020 & 2027

Table 51: Europe Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique - Hybrid Integration,
Monolithic Integration and Module Integration - Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027

Table 52: Europe 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique - Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027

Table 53: Europe Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material - Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials - Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027

Table 54: Europe 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material - Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027

Table 55: Europe Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application - Optical
Communications, Optical Signal Processing and Other
Applications - Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027

Table 56: Europe 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application - Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027

FRANCE
Table 57: France Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique - Hybrid Integration,
Monolithic Integration and Module Integration - Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027

Table 58: France 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique - Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027

Table 59: France Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material - Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials - Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027

Table 60: France 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material - Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027

Table 61: France Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application - Optical
Communications, Optical Signal Processing and Other
Applications - Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027

Table 62: France 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application - Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027

GERMANY
Table 63: Germany Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique - Hybrid Integration,
Monolithic Integration and Module Integration - Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027

Table 64: Germany 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique - Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027

Table 65: Germany Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material - Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials - Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027

Table 66: Germany 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material - Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027

Table 67: Germany Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application - Optical
Communications, Optical Signal Processing and Other
Applications - Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027

Table 68: Germany 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application - Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027

ITALY
Table 69: Italy Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique - Hybrid Integration,
Monolithic Integration and Module Integration - Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027

Table 70: Italy 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique - Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027

Table 71: Italy Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material - Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials - Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027

Table 72: Italy 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material - Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027

Table 73: Italy Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application - Optical
Communications, Optical Signal Processing and Other
Applications - Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027

Table 74: Italy 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application - Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027

UNITED KINGDOM
Robust Expansion on the Cards amid Soaring Investments on Fiber
Optic Networks
Market Analytics
Table 75: UK Current & Future Analysis for Photonic Integrated
Circuit (PIC) by Technique - Hybrid Integration, Monolithic
Integration and Module Integration - Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027

Table 76: UK 7-Year Perspective for Photonic Integrated Circuit
(PIC) by Technique - Percentage Breakdown of Value Sales for
Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027

Table 77: UK Current & Future Analysis for Photonic Integrated
Circuit (PIC) by Raw Material - Indium Phosphide (InP),
Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon
(Si) and Other Raw Materials - Independent Analysis of Annual
Sales in US$ Million for the Years 2020 through 2027

Table 78: UK 7-Year Perspective for Photonic Integrated Circuit
(PIC) by Raw Material - Percentage Breakdown of Value Sales for
Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium
Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the
Years 2020 & 2027

Table 79: UK Current & Future Analysis for Photonic Integrated
Circuit (PIC) by Application - Optical Communications, Optical
Signal Processing and Other Applications - Independent Analysis
of Annual Sales in US$ Million for the Years 2020 through 2027

Table 80: UK 7-Year Perspective for Photonic Integrated Circuit
(PIC) by Application - Percentage Breakdown of Value Sales for
Optical Communications, Optical Signal Processing and Other
Applications for the Years 2020 & 2027

SPAIN
Table 81: Spain Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique - Hybrid Integration,
Monolithic Integration and Module Integration - Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027

Table 82: Spain 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique - Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027

Table 83: Spain Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material - Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials - Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027

Table 84: Spain 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material - Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027

Table 85: Spain Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application - Optical
Communications, Optical Signal Processing and Other
Applications - Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027

Table 86: Spain 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application - Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027

RUSSIA
Table 87: Russia Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique - Hybrid Integration,
Monolithic Integration and Module Integration - Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027

Table 88: Russia 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique - Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027

Table 89: Russia Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material - Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials - Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027

Table 90: Russia 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material - Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027

Table 91: Russia Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application - Optical
Communications, Optical Signal Processing and Other
Applications - Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027

Table 92: Russia 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application - Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027

REST OF EUROPE
Table 93: Rest of Europe Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique - Hybrid Integration,
Monolithic Integration and Module Integration - Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027

Table 94: Rest of Europe 7-Year Perspective for Photonic
Integrated Circuit (PIC) by Technique - Percentage Breakdown of
Value Sales for Hybrid Integration, Monolithic Integration and
Module Integration for the Years 2020 & 2027

Table 95: Rest of Europe Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material - Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials - Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027

Table 96: Rest of Europe 7-Year Perspective for Photonic
Integrated Circuit (PIC) by Raw Material - Percentage Breakdown
of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator
(SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw
Materials for the Years 2020 & 2027

Table 97: Rest of Europe Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application - Optical
Communications, Optical Signal Processing and Other
Applications - Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027

Table 98: Rest of Europe 7-Year Perspective for Photonic
Integrated Circuit (PIC) by Application - Percentage Breakdown
of Value Sales for Optical Communications, Optical Signal
Processing and Other Applications for the Years 2020 & 2027

ASIA-PACIFIC
Healthy Trajectory in Telecommunications Sector Augurs Well
Pan Asian Continental Terrestrial Fiber Optic Network
A Note on Submarine Cables in Asia
Market Analytics
Table 99: Asia-Pacific Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Geographic Region - Australia,
India, South Korea and Rest of Asia-Pacific Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2020 through 2027

Table 100: Asia-Pacific 7-Year Perspective for Photonic
Integrated Circuit (PIC) by Geographic Region - Percentage
Breakdown of Value Sales for Australia, India, South Korea and
Rest of Asia-Pacific Markets for Years 2020 & 2027

Table 101: Asia-Pacific Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique - Hybrid Integration,
Monolithic Integration and Module Integration - Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027

Table 102: Asia-Pacific 7-Year Perspective for Photonic
Integrated Circuit (PIC) by Technique - Percentage Breakdown of
Value Sales for Hybrid Integration, Monolithic Integration and
Module Integration for the Years 2020 & 2027

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