Mi Technovation Berhad (MITNF)

0,5700 0,0000 (0,00 %) À la clôture : 12:53PM EDT

Mi Technovation Berhad

No.20, Medan Bayan Lepas Technoplex
MK 12, Taman Perindustrian Bayan Lepas
Bayan Lepas 11900
Malaysia
60 4 373 8688
https://mi-technovation.com

Secteur(s): Technology
Secteur d’activité: Semiconductor Equipment & Materials
Employés à temps plein: 

Dirigeants clés

Nom	Titre	Payer	Exercé	Année de naissance
Mr. Kuang Eng Oh	Group CEO & Executive Director	1,28k	S.O.	1971
Madam Shiao Voon Yong	Group CFO & Executive Director	1,28k	S.O.	1970
Mr. Chee Kheong Teo	CEO of Semiconductor Equipment Business Unit & Executive Director	1,28k	S.O.	1973
Mr. Kok Lin Heng	CEO of Semiconductor Material Business Unit & Executive Director	1,28k	S.O.	1964
Mr. Henry Wang	President of Semiconductor Material Business Unit	S.O.	S.O.	1952
Ms. Lay Hoon Ch'ng MAICSA	Company Secretary	S.O.	S.O.	S.O.

Les montants ont été établis en date du 31 décembre 2023 et les valeurs de compensation concernent le dernier exercice fiscal clos à cette date. Le terme « rémunération » désigne le salaire, les bonus, etc. Le terme « exercé » est utilisé pour la valeur des options exercées au cours de l’exercice fiscal. Devise exprimée en USD.

Description

Mi Technovation Berhad, an investment holding company, primarily engages in the design, development, manufacture, and sale of semiconductor manufacturing equipment in Southeast Asia, Northeast Asia, and North Atlantic. The company operates through three segments: Semiconductor Equipment Business Unit, Semiconductor Material Business Unit, and Semiconductor Solutions Business Unit. The Semiconductor Equipment Business Unit segment offers assembly and packaging, vision inspection, laser assisted bonding, and power and final test equipment; provides maintenance services and technical support for the machines; and sells associated spare parts and components. The Semiconductor Material Business Unit segment provides solder spheres in various forms, such as small, ultra small, ultralow alpha solder, and copper core solder balls used in ball grid array and wafer level packaging in the semiconductor industry. The Semiconductor Solutions Business Unit segment offers high power modules and devices for wide bandgap applications in automotive and renewable energy sectors. It is also involved in design, development, manufacture, and sale of wafer level chip scale packaging sorting and precision bonding machines; provision of management services; and research and development, manufacture, sale, and marketing of specific process and application in assembly and packaging solutions to customers. The company was formerly known as Mi Equipment Holdings Berhad and changed its name to Mi Technovation Berhad in December 2018. Mi Technovation Berhad was founded in 2007 and is headquartered in Bayan Lepas, Malaysia.

Gouvernance d’entreprise

L’ISS Governance QualityScore de Mi Technovation Berhad en date du S.O. est S.O.. Les scores principaux sont Audit : S.O.; Société : S.O.; Droits des actionnaires : S.O.; Compensation : S.O..

Résultats de gouvernance d’entreprise offerts par Institutional Shareholder Services (ISS). Les résultats indiquent un rang décile par rapport à l’indice ou à la région. Un résultat décile de 1 indique un risque de gouvernance faible, tandis que 10 indique un risque de gouvernance élevé.