Mi Technovation Berhad (MITNF)

0,5700 0,0000 (0,00 %) À la clôture : 12:53PM EDT

Mi Technovation Berhad

No.20, Medan Bayan Lepas Technoplex
MK 12, Taman Perindustrian
Bayan Lepas 11900
Malaysia
60 4 373 8688
https://mi-technovation.com

Secteur(s): Technology
Secteur d’activité: Semiconductor Equipment & Materials
Employés à temps plein: 

Dirigeants clés

Nom	Titre	Payer	Exercé	Année de naissance
Mr. Kuang Eng Oh	Group CEO & Executive Director	1,27k	S.O.	1971
Madam Shiao Voon Yong	Group CFO & Executive Director	1,27k	S.O.	1970
Mr. Chee Kheong Teo	CEO of Semiconductor Equipment Business Unit & Executive Director	1,27k	S.O.	1973
Mr. Kok Lin Heng	CEO of Semiconductor Material Business Unit & Executive Director	1,27k	S.O.	1964
Mr. Henry Wang	President of Semiconductor Material Business Unit	S.O.	S.O.	1952
Ms. Lay Hoon Ch'ng MAICSA	Company Secretary	S.O.	S.O.	S.O.

Les montants ont été établis en date du 31 décembre 2023 et les valeurs de compensation concernent le dernier exercice fiscal clos à cette date. Le terme « rémunération » désigne le salaire, les bonus, etc. Le terme « exercé » est utilisé pour la valeur des options exercées au cours de l’exercice fiscal. Devise exprimée en USD.

Description

Mi Technovation Berhad, an investment holding company, designs, develops, manufactures, and sells wafer level chip scale packaging (WLCSP) sorting machines for the semiconductor industry in Southeast Asia, Northeast Asia, and North Atlantic. The company operates through three segments: Semiconductor Equipment Business Unit, Semiconductor Material Business Unit, and Others. It offers Mi and Vi series products for advanced packaging die and package sorting machines with vision inspection and other applicable functions, as well as wafer and package inspection in 2D and 3D modes for smartphones, tablets, wireless wearable devices, Bluetooth, near field sensing, and sensor applications. The company also provides Ai series product, a precision bonding machine for extra fine pitch with think die and substrate thickness used in telecommunications industry, GPU and CPU for high performance computing application in AI and blockchain, and image sensor and memory applications; and Si series, a final and power test equipment for high power and fine pitch devices used in electric vehicles and telecommunications applications. In addition, it is involved in the provision of maintenance services and technical support for its machines; sale of related spare parts and components; and manufacture and sale of solder spheres and other semiconductor-related materials. The company was formerly known as Mi Equipment Holdings Berhad and changed its name to Mi Technovation Berhad in December 2018. Mi Technovation Berhad was founded in 2007 and is headquartered in Bayan Lepas, Malaysia.

Gouvernance d’entreprise

L’ISS Governance QualityScore de Mi Technovation Berhad en date du S.O. est S.O.. Les scores principaux sont Audit : S.O.; Société : S.O.; Droits des actionnaires : S.O.; Compensation : S.O..

Résultats de gouvernance d’entreprise offerts par Institutional Shareholder Services (ISS). Les résultats indiquent un rang décile par rapport à l’indice ou à la région. Un résultat décile de 1 indique un risque de gouvernance faible, tandis que 10 indique un risque de gouvernance élevé.