Advanced Micro-Fabrication Equipment Inc. China (688012.SS)

140,80 +0,92 (+0,66 %) À la clôture : 03:00PM CST

Advanced Micro-Fabrication Equipment Inc. China

No. 188, Taihua Road
Jinqiao Export Processing Zone (South District) Pudong New Area
Shanghai 201201
China
86 21 6100 1199
https://www.amec-inc.com

Secteur(s): Technology
Secteur d’activité: Semiconductor Equipment & Materials
Employés à temps plein: 1 722

Dirigeants clés

Nom	Titre	Payer	Exercé	Année de naissance
Dr. Gerald Zheyao Yin Ph.D.	Chairman & GM	S.O.	S.O.	1944
Mr. Weiwen Chen	Senior VP & CFO	S.O.	S.O.	1967
Dr. Tuqiang Ni	Senior VP & GM of New Business Group	S.O.	S.O.	1962
Mr. Xiaoyu Liu	Board Secretary & Deputy GM	S.O.	S.O.	1980
Haitao Gao	Group Vice President of Operations	S.O.	S.O.	S.O.
Mr. Matt Ruby	Group Vice President & Chief Legal Officer	S.O.	S.O.	S.O.
Mr. George Cao	Vice President of Corporate Affairs & Corporate Marketing	S.O.	S.O.	S.O.
Wilson He	Group Vice President of Human Resources	S.O.	S.O.	S.O.
Mr. Michael Chu	Senior Vice President of Global Business Management	S.O.	S.O.	S.O.
Ms. Susan Overstreet	VP & President of AMEC North America	S.O.	S.O.	S.O.

Les montants ont été établis en date du et les valeurs de compensation concernent le dernier exercice fiscal clos à cette date. Le terme « rémunération » désigne le salaire, les bonus, etc. Le terme « exercé » est utilisé pour la valeur des options exercées au cours de l’exercice fiscal. Devise exprimée en CNY.

Description

Advanced Micro-Fabrication Equipment Inc. China engages in the research and development, manufacture, and sale of high-end semiconductor equipment and pan-semiconductor equipment in China. It offers capacitive plasma etching equipment that is used in the etching of dielectric materials such as silicon oxide, silicon nitride, and low dielectric coefficient film layers in integrated circuit manufacturing; inductive plasma etching equipment and deep silicon etching equipment, which is used in the etching of monocrystalline silicon, polycrystalline silicon, and various dielectric materials in integrated circuit manufacturing; and MOCVD equipment that is used in the etching of through holes and trenches, such as CMOS image sensors, MEMS chips, 2.5D chips, 3D chips, etc. The company also provides accessories and services to the downstream integrated circuit, LED epitaxial wafer, advanced packaging, MEMS, and other semiconductor product manufacturing companies. Advanced Micro-Fabrication Equipment Inc. China was founded in 2004 and is headquartered in Shanghai, the People's Republic of China.

Gouvernance d’entreprise

L’ISS Governance QualityScore de Advanced Micro-Fabrication Equipment Inc. China en date du S.O. est S.O.. Les scores principaux sont Audit : S.O.; Société : S.O.; Droits des actionnaires : S.O.; Compensation : S.O..

Résultats de gouvernance d’entreprise offerts par Institutional Shareholder Services (ISS). Les résultats indiquent un rang décile par rapport à l’indice ou à la région. Un résultat décile de 1 indique un risque de gouvernance faible, tandis que 10 indique un risque de gouvernance élevé.