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Global Underfill Materials Industry

Global Underfill Materials Market to Reach $465. 6 Million by 2027. Amid the COVID-19 crisis, the global market for Underfill Materials estimated at US$291. 6 Million in the year 2020, is projected to reach a revised size of US$465.

New York, Nov. 04, 2020 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Global Underfill Materials Industry" - https://www.reportlinker.com/p05961205/?utm_source=GNW
6 Million by 2027, growing at a CAGR of 6.9% over the analysis period 2020-2027. Capillary Underfill Material (CUF), one of the segments analyzed in the report, is projected to record a 7.5% CAGR and reach US$273.1 Million by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the No Flow Underfill Material (NUF) segment is readjusted to a revised 6.4% CAGR for the next 7-year period.

The U.S. Market is Estimated at $86.2 Million, While China is Forecast to Grow at 6.4% CAGR

The Underfill Materials market in the U.S. is estimated at US$86.2 Million in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$81.3 Million by the year 2027 trailing a CAGR of 6.4% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 6.5% and 5.5% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 5.6% CAGR.

Molded Underfill Material (MUF) Segment to Record 5.8% CAGR

In the global Molded Underfill Material (MUF) segment, USA, Canada, Japan, China and Europe will drive the 5.8% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$42 Million in the year 2020 will reach a projected size of US$62.5 Million by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$53.5 Million by the year 2027.We bring years of research experience to this 6th edition of our report. The 177-page report presents concise insights into how the pandemic has impacted production and the buy side for 2020 and 2021. A short-term phased recovery by key geography is also addressed.

Competitors identified in this market include, among others,

  • Epoxy Technology, Inc.

  • H.B. Fuller Company

  • Henkel AG & Co. KGaA

  • NAMICS Corporation

  • Nordson Corporation




Read the full report: https://www.reportlinker.com/p05961205/?utm_source=GNW

I. INTRODUCTION, METHODOLOGY & REPORT SCOPE

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW
Global Competitor Market Shares
Underfill Material Competitor Market Share Scenario Worldwide
(in %): 2019 & 2025
Impact of Covid-19 and a Looming Global Recession

2. FOCUS ON SELECT PLAYERS

3. MARKET TRENDS & DRIVERS

4. GLOBAL MARKET PERSPECTIVE
Table 1: World Current & Future Analysis for Underfill
Materials by Geographic Region - USA, Canada, Japan, China,
Europe, Asia-Pacific and Rest of World Markets - Independent
Analysis of Annual Sales in US$ Thousand for Years 2020 through
2027

Table 2: World Historic Review for Underfill Materials by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Sales in US$ Thousand for Years 2012 through 2019

Table 3: World 15-Year Perspective for Underfill Materials by
Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World Markets for Years 2012, 2020 & 2027

Table 4: World Current & Future Analysis for Capillary
Underfill Material (CUF) by Geographic Region - USA, Canada,
Japan, China, Europe, Asia-Pacific and Rest of World Markets -
Independent Analysis of Annual Sales in US$ Thousand for Years
2020 through 2027

Table 5: World Historic Review for Capillary Underfill Material
(CUF) by Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Sales in US$ Thousand for Years 2012 through 2019

Table 6: World 15-Year Perspective for Capillary Underfill
Material (CUF) by Geographic Region - Percentage Breakdown of
Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific
and Rest of World for Years 2012, 2020 & 2027

Table 7: World Current & Future Analysis for No Flow Underfill
Material (NUF) by Geographic Region - USA, Canada, Japan,
China, Europe, Asia-Pacific and Rest of World Markets -
Independent Analysis of Annual Sales in US$ Thousand for Years
2020 through 2027

Table 8: World Historic Review for No Flow Underfill Material
(NUF) by Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Sales in US$ Thousand for Years 2012 through 2019

Table 9: World 15-Year Perspective for No Flow Underfill
Material (NUF) by Geographic Region - Percentage Breakdown of
Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific
and Rest of World for Years 2012, 2020 & 2027

Table 10: World Current & Future Analysis for Molded Underfill
Material (MUF) by Geographic Region - USA, Canada, Japan,
China, Europe, Asia-Pacific and Rest of World Markets -
Independent Analysis of Annual Sales in US$ Thousand for Years
2020 through 2027

Table 11: World Historic Review for Molded Underfill Material
(MUF) by Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Sales in US$ Thousand for Years 2012 through 2019

Table 12: World 15-Year Perspective for Molded Underfill
Material (MUF) by Geographic Region - Percentage Breakdown of
Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific
and Rest of World for Years 2012, 2020 & 2027

Table 13: World Current & Future Analysis for Flip Chips by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Sales in US$ Thousand for Years 2020 through 2027

Table 14: World Historic Review for Flip Chips by Geographic
Region - USA, Canada, Japan, China, Europe, Asia-Pacific and
Rest of World Markets - Independent Analysis of Annual Sales in
US$ Thousand for Years 2012 through 2019

Table 15: World 15-Year Perspective for Flip Chips by
Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World for Years 2012, 2020 & 2027

Table 16: World Current & Future Analysis for Ball Grid Array
(BGA) by Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Sales in US$ Thousand for Years 2020 through 2027

Table 17: World Historic Review for Ball Grid Array (BGA) by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Sales in US$ Thousand for Years 2012 through 2019

Table 18: World 15-Year Perspective for Ball Grid Array (BGA)
by Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World for Years 2012, 2020 & 2027

Table 19: World Current & Future Analysis for Chip Scale
Packaging (CSP) by Geographic Region - USA, Canada, Japan,
China, Europe, Asia-Pacific and Rest of World Markets -
Independent Analysis of Annual Sales in US$ Thousand for Years
2020 through 2027

Table 20: World Historic Review for Chip Scale Packaging (CSP)
by Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Sales in US$ Thousand for Years 2012 through 2019

Table 21: World 15-Year Perspective for Chip Scale Packaging
(CSP) by Geographic Region - Percentage Breakdown of Value
Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and
Rest of World for Years 2012, 2020 & 2027

III. MARKET ANALYSIS

GEOGRAPHIC MARKET ANALYSIS

UNITED STATES
Market Facts & Figures
US Underfill Material Market Share (in %) by Company: 2019 & 2025
Market Analytics
Table 22: USA Current & Future Analysis for Underfill Materials
by Product Type - Capillary Underfill Material (CUF), No Flow
Underfill Material (NUF) and Molded Underfill Material (MUF) -
Independent Analysis of Annual Sales in US$ Thousand for the
Years 2020 through 2027

Table 23: USA Historic Review for Underfill Materials by
Product Type - Capillary Underfill Material (CUF), No Flow
Underfill Material (NUF) and Molded Underfill Material (MUF)
Markets - Independent Analysis of Annual Sales in US$ Thousand
for Years 2012 through 2019

Table 24: USA 15-Year Perspective for Underfill Materials by
Product Type - Percentage Breakdown of Value Sales for
Capillary Underfill Material (CUF), No Flow Underfill Material
(NUF) and Molded Underfill Material (MUF) for the Years 2012,
2020 & 2027

Table 25: USA Current & Future Analysis for Underfill Materials
by Application - Flip Chips, Ball Grid Array (BGA) and Chip
Scale Packaging (CSP) - Independent Analysis of Annual Sales in
US$ Thousand for the Years 2020 through 2027

Table 26: USA Historic Review for Underfill Materials by
Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale
Packaging (CSP) Markets - Independent Analysis of Annual Sales
in US$ Thousand for Years 2012 through 2019

Table 27: USA 15-Year Perspective for Underfill Materials by
Application - Percentage Breakdown of Value Sales for Flip
Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for
the Years 2012, 2020 & 2027

CANADA
Table 28: Canada Current & Future Analysis for Underfill
Materials by Product Type - Capillary Underfill Material (CUF),
No Flow Underfill Material (NUF) and Molded Underfill Material
(MUF) - Independent Analysis of Annual Sales in US$ Thousand
for the Years 2020 through 2027

Table 29: Canada Historic Review for Underfill Materials by
Product Type - Capillary Underfill Material (CUF), No Flow
Underfill Material (NUF) and Molded Underfill Material (MUF)
Markets - Independent Analysis of Annual Sales in US$ Thousand
for Years 2012 through 2019

Table 30: Canada 15-Year Perspective for Underfill Materials by
Product Type - Percentage Breakdown of Value Sales for
Capillary Underfill Material (CUF), No Flow Underfill Material
(NUF) and Molded Underfill Material (MUF) for the Years 2012,
2020 & 2027

Table 31: Canada Current & Future Analysis for Underfill
Materials by Application - Flip Chips, Ball Grid Array (BGA)
and Chip Scale Packaging (CSP) - Independent Analysis of Annual
Sales in US$ Thousand for the Years 2020 through 2027

Table 32: Canada Historic Review for Underfill Materials by
Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale
Packaging (CSP) Markets - Independent Analysis of Annual Sales
in US$ Thousand for Years 2012 through 2019

Table 33: Canada 15-Year Perspective for Underfill Materials by
Application - Percentage Breakdown of Value Sales for Flip
Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for
the Years 2012, 2020 & 2027

JAPAN
Table 34: Japan Current & Future Analysis for Underfill
Materials by Product Type - Capillary Underfill Material (CUF),
No Flow Underfill Material (NUF) and Molded Underfill Material
(MUF) - Independent Analysis of Annual Sales in US$ Thousand
for the Years 2020 through 2027

Table 35: Japan Historic Review for Underfill Materials by
Product Type - Capillary Underfill Material (CUF), No Flow
Underfill Material (NUF) and Molded Underfill Material (MUF)
Markets - Independent Analysis of Annual Sales in US$ Thousand
for Years 2012 through 2019

Table 36: Japan 15-Year Perspective for Underfill Materials by
Product Type - Percentage Breakdown of Value Sales for
Capillary Underfill Material (CUF), No Flow Underfill Material
(NUF) and Molded Underfill Material (MUF) for the Years 2012,
2020 & 2027

Table 37: Japan Current & Future Analysis for Underfill
Materials by Application - Flip Chips, Ball Grid Array (BGA)
and Chip Scale Packaging (CSP) - Independent Analysis of Annual
Sales in US$ Thousand for the Years 2020 through 2027

Table 38: Japan Historic Review for Underfill Materials by
Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale
Packaging (CSP) Markets - Independent Analysis of Annual Sales
in US$ Thousand for Years 2012 through 2019

Table 39: Japan 15-Year Perspective for Underfill Materials by
Application - Percentage Breakdown of Value Sales for Flip
Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for
the Years 2012, 2020 & 2027

CHINA
Table 40: China Current & Future Analysis for Underfill
Materials by Product Type - Capillary Underfill Material (CUF),
No Flow Underfill Material (NUF) and Molded Underfill Material
(MUF) - Independent Analysis of Annual Sales in US$ Thousand
for the Years 2020 through 2027

Table 41: China Historic Review for Underfill Materials by
Product Type - Capillary Underfill Material (CUF), No Flow
Underfill Material (NUF) and Molded Underfill Material (MUF)
Markets - Independent Analysis of Annual Sales in US$ Thousand
for Years 2012 through 2019

Table 42: China 15-Year Perspective for Underfill Materials by
Product Type - Percentage Breakdown of Value Sales for
Capillary Underfill Material (CUF), No Flow Underfill Material
(NUF) and Molded Underfill Material (MUF) for the Years 2012,
2020 & 2027

Table 43: China Current & Future Analysis for Underfill
Materials by Application - Flip Chips, Ball Grid Array (BGA)
and Chip Scale Packaging (CSP) - Independent Analysis of Annual
Sales in US$ Thousand for the Years 2020 through 2027

Table 44: China Historic Review for Underfill Materials by
Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale
Packaging (CSP) Markets - Independent Analysis of Annual Sales
in US$ Thousand for Years 2012 through 2019

Table 45: China 15-Year Perspective for Underfill Materials by
Application - Percentage Breakdown of Value Sales for Flip
Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for
the Years 2012, 2020 & 2027

EUROPE
Market Facts & Figures
European Underfill Material Market: Competitor Market Share
Scenario (in %) for 2019 & 2025
Market Analytics
Table 46: Europe Current & Future Analysis for Underfill
Materials by Geographic Region - France, Germany, Italy, UK and
Rest of Europe Markets - Independent Analysis of Annual Sales
in US$ Thousand for Years 2020 through 2027

Table 47: Europe Historic Review for Underfill Materials by
Geographic Region - France, Germany, Italy, UK and Rest of
Europe Markets - Independent Analysis of Annual Sales in US$
Thousand for Years 2012 through 2019

Table 48: Europe 15-Year Perspective for Underfill Materials by
Geographic Region - Percentage Breakdown of Value Sales for
France, Germany, Italy, UK and Rest of Europe Markets for Years
2012, 2020 & 2027

Table 49: Europe Current & Future Analysis for Underfill
Materials by Product Type - Capillary Underfill Material (CUF),
No Flow Underfill Material (NUF) and Molded Underfill Material
(MUF) - Independent Analysis of Annual Sales in US$ Thousand
for the Years 2020 through 2027

Table 50: Europe Historic Review for Underfill Materials by
Product Type - Capillary Underfill Material (CUF), No Flow
Underfill Material (NUF) and Molded Underfill Material (MUF)
Markets - Independent Analysis of Annual Sales in US$ Thousand
for Years 2012 through 2019

Table 51: Europe 15-Year Perspective for Underfill Materials by
Product Type - Percentage Breakdown of Value Sales for
Capillary Underfill Material (CUF), No Flow Underfill Material
(NUF) and Molded Underfill Material (MUF) for the Years 2012,
2020 & 2027

Table 52: Europe Current & Future Analysis for Underfill
Materials by Application - Flip Chips, Ball Grid Array (BGA)
and Chip Scale Packaging (CSP) - Independent Analysis of Annual
Sales in US$ Thousand for the Years 2020 through 2027

Table 53: Europe Historic Review for Underfill Materials by
Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale
Packaging (CSP) Markets - Independent Analysis of Annual Sales
in US$ Thousand for Years 2012 through 2019

Table 54: Europe 15-Year Perspective for Underfill Materials by
Application - Percentage Breakdown of Value Sales for Flip
Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for
the Years 2012, 2020 & 2027

FRANCE
Table 55: France Current & Future Analysis for Underfill
Materials by Product Type - Capillary Underfill Material (CUF),
No Flow Underfill Material (NUF) and Molded Underfill Material
(MUF) - Independent Analysis of Annual Sales in US$ Thousand
for the Years 2020 through 2027

Table 56: France Historic Review for Underfill Materials by
Product Type - Capillary Underfill Material (CUF), No Flow
Underfill Material (NUF) and Molded Underfill Material (MUF)
Markets - Independent Analysis of Annual Sales in US$ Thousand
for Years 2012 through 2019

Table 57: France 15-Year Perspective for Underfill Materials by
Product Type - Percentage Breakdown of Value Sales for
Capillary Underfill Material (CUF), No Flow Underfill Material
(NUF) and Molded Underfill Material (MUF) for the Years 2012,
2020 & 2027

Table 58: France Current & Future Analysis for Underfill
Materials by Application - Flip Chips, Ball Grid Array (BGA)
and Chip Scale Packaging (CSP) - Independent Analysis of Annual
Sales in US$ Thousand for the Years 2020 through 2027

Table 59: France Historic Review for Underfill Materials by
Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale
Packaging (CSP) Markets - Independent Analysis of Annual Sales
in US$ Thousand for Years 2012 through 2019

Table 60: France 15-Year Perspective for Underfill Materials by
Application - Percentage Breakdown of Value Sales for Flip
Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for
the Years 2012, 2020 & 2027

GERMANY
Table 61: Germany Current & Future Analysis for Underfill
Materials by Product Type - Capillary Underfill Material (CUF),
No Flow Underfill Material (NUF) and Molded Underfill Material
(MUF) - Independent Analysis of Annual Sales in US$ Thousand
for the Years 2020 through 2027

Table 62: Germany Historic Review for Underfill Materials by
Product Type - Capillary Underfill Material (CUF), No Flow
Underfill Material (NUF) and Molded Underfill Material (MUF)
Markets - Independent Analysis of Annual Sales in US$ Thousand
for Years 2012 through 2019

Table 63: Germany 15-Year Perspective for Underfill Materials
by Product Type - Percentage Breakdown of Value Sales for
Capillary Underfill Material (CUF), No Flow Underfill Material
(NUF) and Molded Underfill Material (MUF) for the Years 2012,
2020 & 2027

Table 64: Germany Current & Future Analysis for Underfill
Materials by Application - Flip Chips, Ball Grid Array (BGA)
and Chip Scale Packaging (CSP) - Independent Analysis of Annual
Sales in US$ Thousand for the Years 2020 through 2027

Table 65: Germany Historic Review for Underfill Materials by
Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale
Packaging (CSP) Markets - Independent Analysis of Annual Sales
in US$ Thousand for Years 2012 through 2019

Table 66: Germany 15-Year Perspective for Underfill Materials
by Application - Percentage Breakdown of Value Sales for Flip
Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for
the Years 2012, 2020 & 2027

ITALY
Table 67: Italy Current & Future Analysis for Underfill
Materials by Product Type - Capillary Underfill Material (CUF),
No Flow Underfill Material (NUF) and Molded Underfill Material
(MUF) - Independent Analysis of Annual Sales in US$ Thousand
for the Years 2020 through 2027

Table 68: Italy Historic Review for Underfill Materials by
Product Type - Capillary Underfill Material (CUF), No Flow
Underfill Material (NUF) and Molded Underfill Material (MUF)
Markets - Independent Analysis of Annual Sales in US$ Thousand
for Years 2012 through 2019

Table 69: Italy 15-Year Perspective for Underfill Materials by
Product Type - Percentage Breakdown of Value Sales for
Capillary Underfill Material (CUF), No Flow Underfill Material
(NUF) and Molded Underfill Material (MUF) for the Years 2012,
2020 & 2027

Table 70: Italy Current & Future Analysis for Underfill
Materials by Application - Flip Chips, Ball Grid Array (BGA)
and Chip Scale Packaging (CSP) - Independent Analysis of Annual
Sales in US$ Thousand for the Years 2020 through 2027

Table 71: Italy Historic Review for Underfill Materials by
Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale
Packaging (CSP) Markets - Independent Analysis of Annual Sales
in US$ Thousand for Years 2012 through 2019

Table 72: Italy 15-Year Perspective for Underfill Materials by
Application - Percentage Breakdown of Value Sales for Flip
Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for
the Years 2012, 2020 & 2027

UNITED KINGDOM
Table 73: UK Current & Future Analysis for Underfill Materials
by Product Type - Capillary Underfill Material (CUF), No Flow
Underfill Material (NUF) and Molded Underfill Material (MUF) -
Independent Analysis of Annual Sales in US$ Thousand for the
Years 2020 through 2027

Table 74: UK Historic Review for Underfill Materials by Product
Type - Capillary Underfill Material (CUF), No Flow Underfill
Material (NUF) and Molded Underfill Material (MUF) Markets -
Independent Analysis of Annual Sales in US$ Thousand for Years
2012 through 2019

Table 75: UK 15-Year Perspective for Underfill Materials by
Product Type - Percentage Breakdown of Value Sales for
Capillary Underfill Material (CUF), No Flow Underfill Material
(NUF) and Molded Underfill Material (MUF) for the Years 2012,
2020 & 2027

Table 76: UK Current & Future Analysis for Underfill Materials
by Application - Flip Chips, Ball Grid Array (BGA) and Chip
Scale Packaging (CSP) - Independent Analysis of Annual Sales in
US$ Thousand for the Years 2020 through 2027

Table 77: UK Historic Review for Underfill Materials by
Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale
Packaging (CSP) Markets - Independent Analysis of Annual Sales
in US$ Thousand for Years 2012 through 2019

Table 78: UK 15-Year Perspective for Underfill Materials by
Application - Percentage Breakdown of Value Sales for Flip
Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for
the Years 2012, 2020 & 2027

REST OF EUROPE
Table 79: Rest of Europe Current & Future Analysis for
Underfill Materials by Product Type - Capillary Underfill
Material (CUF), No Flow Underfill Material (NUF) and Molded
Underfill Material (MUF) - Independent Analysis of Annual Sales
in US$ Thousand for the Years 2020 through 2027

Table 80: Rest of Europe Historic Review for Underfill
Materials by Product Type - Capillary Underfill Material (CUF),
No Flow Underfill Material (NUF) and Molded Underfill Material
(MUF) Markets - Independent Analysis of Annual Sales in US$
Thousand for Years 2012 through 2019

Table 81: Rest of Europe 15-Year Perspective for Underfill
Materials by Product Type - Percentage Breakdown of Value Sales
for Capillary Underfill Material (CUF), No Flow Underfill
Material (NUF) and Molded Underfill Material (MUF) for the
Years 2012, 2020 & 2027

Table 82: Rest of Europe Current & Future Analysis for
Underfill Materials by Application - Flip Chips, Ball Grid
Array (BGA) and Chip Scale Packaging (CSP) - Independent
Analysis of Annual Sales in US$ Thousand for the Years 2020
through 2027

Table 83: Rest of Europe Historic Review for Underfill
Materials by Application - Flip Chips, Ball Grid Array (BGA)
and Chip Scale Packaging (CSP) Markets - Independent Analysis
of Annual Sales in US$ Thousand for Years 2012 through 2019

Table 84: Rest of Europe 15-Year Perspective for Underfill
Materials by Application - Percentage Breakdown of Value Sales
for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging
(CSP) for the Years 2012, 2020 & 2027

ASIA-PACIFIC
Table 85: Asia-Pacific Current & Future Analysis for Underfill
Materials by Product Type - Capillary Underfill Material (CUF),
No Flow Underfill Material (NUF) and Molded Underfill Material
(MUF) - Independent Analysis of Annual Sales in US$ Thousand
for the Years 2020 through 2027

Table 86: Asia-Pacific Historic Review for Underfill Materials
by Product Type - Capillary Underfill Material (CUF), No Flow
Underfill Material (NUF) and Molded Underfill Material (MUF)
Markets - Independent Analysis of Annual Sales in US$ Thousand
for Years 2012 through 2019

Table 87: Asia-Pacific 15-Year Perspective for Underfill
Materials by Product Type - Percentage Breakdown of Value Sales
for Capillary Underfill Material (CUF), No Flow Underfill
Material (NUF) and Molded Underfill Material (MUF) for the
Years 2012, 2020 & 2027

Table 88: Asia-Pacific Current & Future Analysis for Underfill
Materials by Application - Flip Chips, Ball Grid Array (BGA)
and Chip Scale Packaging (CSP) - Independent Analysis of Annual
Sales in US$ Thousand for the Years 2020 through 2027

Table 89: Asia-Pacific Historic Review for Underfill Materials
by Application - Flip Chips, Ball Grid Array (BGA) and Chip
Scale Packaging (CSP) Markets - Independent Analysis of Annual
Sales in US$ Thousand for Years 2012 through 2019

Table 90: Asia-Pacific 15-Year Perspective for Underfill
Materials by Application - Percentage Breakdown of Value Sales
for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging
(CSP) for the Years 2012, 2020 & 2027

REST OF WORLD
Table 91: Rest of World Current & Future Analysis for Underfill
Materials by Product Type - Capillary Underfill Material (CUF),
No Flow Underfill Material (NUF) and Molded Underfill Material
(MUF) - Independent Analysis of Annual Sales in US$ Thousand
for the Years 2020 through 2027

Table 92: Rest of World Historic Review for Underfill Materials
by Product Type - Capillary Underfill Material (CUF), No Flow
Underfill Material (NUF) and Molded Underfill Material (MUF)
Markets - Independent Analysis of Annual Sales in US$ Thousand
for Years 2012 through 2019

Table 93: Rest of World 15-Year Perspective for Underfill
Materials by Product Type - Percentage Breakdown of Value Sales
for Capillary Underfill Material (CUF), No Flow Underfill
Material (NUF) and Molded Underfill Material (MUF) for the
Years 2012, 2020 & 2027

Table 94: Rest of World Current & Future Analysis for Underfill
Materials by Application - Flip Chips, Ball Grid Array (BGA)
and Chip Scale Packaging (CSP) - Independent Analysis of Annual
Sales in US$ Thousand for the Years 2020 through 2027

Table 95: Rest of World Historic Review for Underfill Materials
by Application - Flip Chips, Ball Grid Array (BGA) and Chip
Scale Packaging (CSP) Markets - Independent Analysis of Annual
Sales in US$ Thousand for Years 2012 through 2019

Table 96: Rest of World 15-Year Perspective for Underfill
Materials by Application - Percentage Breakdown of Value Sales
for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging
(CSP) for the Years 2012, 2020 & 2027

IV. COMPETITION
Total Companies Profiled: 42
Read the full report: https://www.reportlinker.com/p05961205/?utm_source=GNW

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